Individual skill
pcb-designer
Design, review, calculate, and release printed circuit boards for embedded, IoT, mixed-signal, power, and RF projects. Use when the user mentions PCB, schematic capture, layout, stackup, BOM, Gerber, pick-and-place, DRC/ERC, DFM/DFA, impedance, EMI/EMC, thermal design, EasyEDA/嘉立创EDA, KiCad, JLCPCB, or board bring-up. Not for mechanical-only enclosure design or IC-level silicon design.
SKILL.md
Source commit d808009800f78fa37bc13c009cf6070301d34c23
What was checked
- Matches the observed repository HEAD
- Yes
- Scanner rules are current
- Yes
- Repository scan complete
- No
- Skill scan complete
- No
- Observed behavior
- Local scripts
- Last checked
- Nov 7, 2026
These are observations at the recorded commit, not a guarantee of safety. Review the source before running it.
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Repository context
- Repository stars (not skill ratings)
- 15
- Repository last updated
- Sep 13, 2026
- License
- MIT
Observed agent integration: codex
- claude-code Repository topic
- claude-skill Repository topic
- dfm Repository topic
- electronics Repository topic
- embedded-hardware Repository topic
- esp32 Repository topic
- hardware-design Repository topic
- jlcpcb Repository topic
- kicad Repository topic
- lceda Repository topic
- design Derived category
Files and excerpt
File metadata and permitted, redacted excerpts come from the recorded scan. Source links are pinned to that commit.
Browse files
.github/CODEOWNERSasset · 11 bytes.github/ISSUE_TEMPLATE/bug_report.ymlasset · 1,060 bytes.github/ISSUE_TEMPLATE/config.ymlasset · 351 bytes.github/ISSUE_TEMPLATE/design_review_request.ymlasset · 1,044 bytes.github/ISSUE_TEMPLATE/feature_request.ymlasset · 940 bytes.github/dependabot.ymlasset · 151 bytes.github/pull_request_template.mddoc · 492 bytes.github/release-notes/v3.0.0.mddoc · 1,739 bytes.github/release-notes/v3.0.1.mddoc · 846 bytes.github/workflows/release.ymlasset · 952 bytes.github/workflows/validate.ymlasset · 1,158 bytes.gitignoreasset · 540 bytesAGENTS.mddoc · 1,001 bytesCHANGELOG.mddoc · 1,992 bytesCITATION.cffasset · 544 bytesCODE_OF_CONDUCT.mddoc · 1,257 bytesCONTRIBUTING.mddoc · 2,551 bytesLICENSEasset · 1,071 bytesREADME.mddoc · 9,568 bytesREADME.zh-CN.mddoc · 5,720 bytesSECURITY.mddoc · 1,097 bytesSKILL.mdcore · 9,855 bytesSKILL.mdcore · 9,855 bytesSKILL.mdcore · 9,855 bytesSKILL.mdcore · 9,855 bytesagents/openai.yamlasset · 287 bytesassets/social-preview.pngasset · 47,225 bytesevals/evals.jsonasset · 10,287 bytesexamples/beginner-first-board.mddoc · 1,768 bytesexamples/esp32s3-flight-computer.mddoc · 5,089 bytesexamples/review-example.mddoc · 2,226 bytesllms.txtdoc · 1,134 bytesreferences/analog-design.mddoc · 5,712 bytesreferences/bringup-and-validation.mddoc · 2,961 bytesreferences/calculation-models.mddoc · 4,674 bytesreferences/communication-interfaces.mddoc · 6,076 bytesreferences/compliance-certification.mddoc · 5,644 bytesreferences/component-selection.mddoc · 4,578 bytesreferences/cost-optimization.mddoc · 5,600 bytesreferences/design-intake.mddoc · 3,774 bytesreferences/design-review-rubric.mddoc · 4,880 bytesreferences/dfm-checklist.mddoc · 10,000 bytesreferences/emc-guidelines.mddoc · 5,974 bytesreferences/high-reliability.mddoc · 4,375 bytesreferences/high-speed-digital.mddoc · 5,556 bytesreferences/kicad-workflow.mddoc · 2,039 bytesreferences/layer-choice.mddoc · 2,881 bytesreferences/lceda-workflow.mddoc · 4,229 bytesreferences/manufacturing-production.mddoc · 6,936 bytesreferences/mcu-platforms.mddoc · 5,930 bytesreferences/pcb-materials.mddoc · 6,534 bytesreferences/power-design.mddoc · 4,717 bytesreferences/protection-reliability.mddoc · 5,397 bytesreferences/release-checklist.mddoc · 3,916 bytesreferences/rf-design.mddoc · 5,659 bytesreferences/schematic-review.mddoc · 3,432 bytesreferences/stackup-and-impedance.mddoc · 5,571 bytesreferences/standards-and-sources.mddoc · 2,795 bytesreferences/testing-debug.mddoc · 4,210 bytesreferences/thermal-design.mddoc · 4,007 bytesrules/design-rules.jsonasset · 2,053 bytesrules/fab-profiles.jsonasset · 3,660 bytesscripts/__init__.pyruns · 53 bytesscripts/audit_release.pyruns · 23,124 bytesscripts/generate_social_preview.pyruns · 4,260 bytesscripts/install.pyruns · 4,140 bytesscripts/package_skill.pyruns · 2,689 bytesscripts/pcbcalc.pyruns · 28,504 bytesscripts/validate_skill.pyruns · 10,627 bytestemplates/bringup-log.mddoc · 1,366 bytestemplates/design-brief.mddoc · 1,908 bytestemplates/design-review-report.mddoc · 871 bytestemplates/fab-release-checklist.mddoc · 1,163 bytestemplates/power-budget.csvasset · 214 bytestemplates/supplier-rfq.mddoc · 1,710 bytestests/__init__.pyruns · 30 bytestests/test_audit_release.pyruns · 3,937 bytestests/test_package_skill.pyruns · 942 bytestests/test_pcbcalc.pyruns · 6,461 bytestests/test_validate_skill.pyruns · 413 bytes
Read excerpt
# PCB Designer
Use this skill as a senior hardware design partner. It covers requirements,
component selection, schematic review, stackup, placement, routing, power,
signal integrity, thermal design, manufacturing release, compliance, and
bring-up.
## Operating Rules
1. **Verify before asserting.** Datasheets, reference designs, current fab
capabilities, and the user's actual files override generic guidance.
Never invent pinouts, part numbers, LCSC IDs, ratings, prices, or stackup
dimensions.
2. **Separate facts, assumptions, and recommendations.** State missing